Fastmicro Particle Defect Inspection System (PDIS)
The Fastmicro Particle Defect Inspection System has been developed to measure surface particle contamination levels directly on a product’s surfaces in any industry. The primary applications are in Semiconductor (pellicles, reticles, wafers) and the display market. The inspection system has an unlimited scanning area due to its modular and scalable design.
The system can be customized, depending on the shape and position of the surface that needs to be tested. The scanner module is also available as a white label solution for system integrators.
400 WPH Particle Defect Inspection of 12 inch Wafers
System Specifications
Production Throughput : Capable of 400 Wafers-Per-Hour (WPH)
Analysis : Quantity, Location and Size of particles
Reporting : Qualification report in UI or PDF, acc. to ISO-14644-9
Data output
: KLARF, XML, Excel & Text files (incl standard bin sizes)
Detection limit : Capable from 0.1 um PSL particles and up
Reproducibility : 99% cumulative particle count standard particles
Sizing accuracy : Within 20% PSL particles
Location accuracy : 40 um accuracy, 15 um location repeatability
Top/Bottom inspection : Single measurement / No flipping
Control : Fully digital controlled devicenet-ethernet
8 inch
Manual
FM-WM8-PDIS-V01
- Configurable substrate sizes 100 / 150 / 200 mm
-
Manual loader
- Footprint: 1335x660x2047mm [LxWxH]
8 inch
Automated
FM-WA8-PDIS-V01
- Configurable substrate sizes 100 / 150 / 200 mm
- 2 integrated Cassette Stations or SMIF's
- Footprint: 1335x1320x2047mm [LxWxH]
12 inch
Manual
FM-WM12-PDIS-V01
- Configurable substrate sizes 150 / 200 / 300 mm
- Manual loader
- Footprint: 1602x755x2099mm [LxWxH]
12 inch
Automated
FM-WA12-PDIS-V01
- Configurable substrate sizes 150 / 200 / 300 mm
- 2 FOUP loaders
- Footprint: 1510x1602x2099mm [LxWxH]
ScannerBox (White-label)
FM-SB12-PDIS-V01
Basic features
Substrate sizes
: Configurable 300 mm
Production Throughput
: Scanning time 2 s seconds
Analysis : Quantity, Location and Size of particles
Reporting : according ISO-14644-9
Data output
: KLARF, XML, Excel & Text files (incl standard bin sizes)
Detection limit : Capable from 0.1 um PSL particles and up
Reproducibility: 99% cumulative particle count standard particles
Sizing accuracy : Within 20% PSL particles
Location accuracy : 40 um accuracy, 15 um location repeatability
Footprint : 1335x505x840mm [LxWxH]
Upgrades
Top/Bottom inspection : Backside wear detection
Automation : Capable of 400 Wafers-Per-Hour (WPH)
Non-wafer measurement : e.g. Pellicles / Reticles
Control : Fully digital controlled devicenet-ethernet
Applications
The Fastmicro Particle Defect Inspection System (PDIS) can be used for measurements of:
- Pellicles (front and backside)
- Reticles, photomasks (backside)
- 6 / 8/ 12 inch Wafers (backside, blanks, bevels)
- 3Di (e.g. copper to copper bonding)
- Critical parts
Manual and Automated modular:
Fit for each production process
The modular Fastmicro Particle Defect Inspection System can be customized to suit each production qualification process or to fit into a production line. This can include clean and automated handling: package openers for inspection and cleaning, filling stations, robot arms, an inspection spot and a port for cleaning.
The Fastmicro module allows for a scaled inspection surface to suit customer needs, without introducing extra imaging time and using limited floor space.
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