The Fastmicro Particle Defect Inspection System has been developed to measure surface particle contamination levels directly on a product’s surfaces in any industry down to 100 nm Lower Detection Limit (LDL) at very fast throughput speeds. The primary applications are in Semiconductor (pellicles, reticles, wafers) and the display market. The scanning area is expandable to very large surfaces, like LCD substrates due to its modular and scalable design.
The scanner module is also available as a white label OEM solution for system integrators.
Particle Defect Inspection Systems
8-inch Manual
FM-WM8-PDS-V01
Configurable substrate sizes:
100 / 150 / 200 mm
Manual loader
Footprint:
1335x660x2047mm [LxWxH]
8-inch Automated
FM-WA8-PDS-V01
Configurable substrate sizes:
100 / 150 / 200 mm
2 integrated Cassette Stations or SMIF's
Footprint:
1335x1320x2047mm [LxWxH]
12-inch Manual
FM-WM12-PDS-V01
Configurable substrate sizes:
150 / 200 / 300 mm
Manual loader
Footprint:
1602x755x2099mm [LxWxH]
12-inch Automated
FM-WA12-PDS-V01
Configurable substrate sizes:
150 / 200 / 300 mm
2 FOUP loaders
Footprint:
1510x1602x2099mm [LxWxH]
The Fastmicro Particle Defect Inspection System Applications
PDIS can be used for particle measurements on:
- Replace multiple legacy systems for one; save floorspace
- Top- and bottom-side inspection without flipping
- 4 / 6 / 8/ 12-inch Si, SiC, GaN, Glass, Sapphire and Compound Wafers (backside, blanks, bevels)
- For photomask: pellicles, reticles (front and backside)
- 3Di Advanced Packaging (e.g. hybrid bonding)
- No moving parts: clean and robust
- Pre-scan to accelerate workflow for further particle analysis
- Manual and Automated up to 12-inch wafers
- High Purity Critical parts
High Purity Critical parts
3Di
copper to copper
WAFERS
backside blanks bevels
RETICLES
photomasks backside
PELLICLES
front and backside
FAST
QUANTITATIVE
EASY TO OPERATE
ACCURATE
CONSISTENT
HIGH THROUGHPUT
Contact us
about anything related to our Particle Defect Inspection Systems.