Defect Inspection

Automated and Manual up to 4-6-8 and 12-inch wafers.

  Detection limit from 0.1 µm and up PSL particles

  High-throughput 400 Wafer Per Hour (WPH)

  Location accuracy 40 µm, location repeatability 15 µm

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FM-PDS: multi-application modular platform

The modular Fastmicro Particle Defect Inspection System metrology platform can be customized to suit each production qualification process or to fit into a production line. This can include manual and automated wafer handling: package openers for inspection and cleaning, filling stations, robot arms, an inspection spot and a port for cleaning. 

The Fastmicro system allows for a scaled inspection surface to suit customer needs, without introducing extra imaging time and using limited floor space.

Direct measurements on product surface

The Fastmicro Particle Defect Inspection System has been developed to measure surface particle contamination levels directly on a product surface in any industry. The primary applications are wafer, pellicles and reticles inspection in Semicon, but also substrates, like in the display market. 

The Particle Defect Inspection System has a 4 to 12-inch FOV scanning area, with top- & -bottom-side capability, without moving the product in the metrology stage due to its distinct optics design.

The system can be customized, depending on the surface that needs to be tested. The metrology module is also available as a white label solution for system integrators and OEM’s. 

Wafer PDS Applications

front and backside

photomasks backside

backside blanks bevels

 copper to copper

High Purity Critical parts

Are you ready for the next step in cleanliness control?

Contact us and make your particle measurement in seconds.

Wafer PDS Specifications

Fast and High Production Throughput

  • High Throughput: capable of over 300 Wafer-Per-Hour (WPH)
  • Imaging in seconds on wafer substrates of 4-6-8-inch and 12-inch

Data Output

  • Qualification GO/NOGO: Cumulative count, Position and Size particle data
  • Annotated UI with particle detection overlay, plus ‘3D’ signal representation of any operator-selected particle
  • Analysis: export function including KLARF, Excel and Text Files (including standard bin sizes) and optional upgrade for XML data output 
  • Monitoring report SCP-class in UI and PDF, according to ISO standard 14644-9
  • Fully digital controlled, devicenet-ethernet 
  • SECS/GEM factory automation and optional GEM300/EDA integration

Easy to Operate

  • Operator independent
  • Integrated UI
  • Manual Wafer loader: 2 to 4 cassette stations or 2 integrated SMIFs
  • Automated Wafer loader: 2 FOUP loaders
  • 5 axis dual arm robot handling with specific substrate grippers
  • In-Line possible to use multi-purpose recipes

Detection Range

  • Detection limits capable from 100 nm (0.1 µm) PSL particles und up

Top/Bottom Inspection

  • Optional upgrade top-bottom inspection in single measurement (no flipping)


  • Over 99% cumulative particle count with standard particles capable from 0.1 µm

Sizing and location accuracy

  • Within 20% with PSL equivalent particles
  • Location accuracy 40 µm, location repeatability 15 µm

Lifetime & clean manufacturing practice

  • No contact & moving parts, minimal particle generation, maximum cleanliness
  • No movement and friction in metrology, low maintenance interval  
  • Low cost-of-ownership

Requirements on product

  • Roughness Ra < 50 nm

Models and footprint

  • FM-W8M-PDS-V01: 4-6-8-inch Manual | 660x1335x2047mm [LxWxH]
  • FM-W8A-PDS-V01: 4-6-8-inch Automated | 1320x1335x2047mm [LxWxH]
  • FM-W12M-PDS-V01: 12-inch Manual | 1602x755x2099mm [LxWxH]
  • FM-W12A-PDS-V01: 12-inch Automated | 1602x1510x2099mm [LxWxH]
  • FM-OEM-PDS-V01 | Multi-purpose OEM module

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about anything related to our Wafer Defect Inspection.